Volume 14 Issue 1
Jan.  2024
Turn off MathJax
Article Contents
LI P B,ZHANG L N,ZHANG X,et al.Recycling of non-metallic components in PCB based on 298/77 K cycle treatment[J].Journal of Environmental Engineering Technology,2024,14(1):204-209 doi: 10.12153/j.issn.1674-991X.20230156
Citation: LI P B,ZHANG L N,ZHANG X,et al.Recycling of non-metallic components in PCB based on 298/77 K cycle treatment[J].Journal of Environmental Engineering Technology,2024,14(1):204-209 doi: 10.12153/j.issn.1674-991X.20230156

Recycling of non-metallic components in PCB based on 298/77 K cycle treatment

doi: 10.12153/j.issn.1674-991X.20230156
  • Received Date: 2023-02-27
  • Accepted Date: 2023-05-24
  • Rev Recd Date: 2023-04-07
  • Available Online: 2023-08-01
  • In order to solve the problems of difficult recovery of non-metallic components and high secondary pollution rate in waste printed circuit board (PCB), 298/77 K cycling treatment technology was introduced. First, the effect of temperature change on the internal structure of PCB and the change of mechanical properties in PCB were analyzed, and the actual effect of static and centrifugal separation on the recovery rate of non-metallic components in PCB was tested. Then, CaF2 was introduced as strong oxidant in the refining process. The recovery of silicon components after the change of internal structure of PCB was tested and the actual purity of silicon elements after recovery was determined. The results showed that after 298/77 K cycle treatment, the internal structure of PCB changed significantly under the influence of temperature cycle. The mechanical properties were significantly reduced. The actual output of PCB non-metallic components and the recovery of silicon components had been significantly improved compared with the traditional treatment, and the impurities in the original PCB had been well removed. The mass fraction of silicon element accounted for more than 97%.

     

  • loading
  • [1]
    赵彤, 刘祎, 刘美佳, 等.合成树脂行业固体废物产生节点及环境管理分析[J]. 环境工程技术学报,2021,11(5):1020-1026.

    ZHAO T, LIU Y, LIU M J, et al. Analysis of solid waste generation nodes and environmental management in the synthetic resin industry[J]. Journal of Environmental Engineering Technology,2021,11(5):1020-1026.
    [2]
    刘重伟, 徐志峰, 陈清, 等.废旧电路板回收技术研究进展[J]. 萍乡学院学报,2020,37(6):57-63.

    LIU C W, XU Z F, CHEN Q, et al. Research progress in recycling technology of waste printed circuit boards[J]. Journal of Pingxiang University,2020,37(6):57-63.
    [3]
    陈斌. 废旧电路板金属资源分级分离回收及过程控制研究[D]. 合肥: 中国科学技术大学, 2020.
    [4]
    胡梦坤. 废旧电路板上晶体管中有机物的去除及其铅与铜的分离[D]. 上海: 上海交通大学, 2018.
    [5]
    秦琦, 宋乾武, 吴兆晴, 等.PCB行业环境治理之技术需求[J]. 环境工程技术学报,2012,2(5):456-460.

    QIN Q, SONG Q W, WU Z Q, et al. Technology requirements of PCB industry environmental management[J]. Journal of Environmental Engineering Technology,2012,2(5):456-460.
    [6]
    闫晓慧, 李桂春, 孟齐.废旧电路板中铜的回收技术研究进展[J]. 应用化工,2019,48(9):2193-2197.

    YAN X H, LI G C, MENG Q. Research progress of copper recovery technology in waste circuit board[J]. Applied Chemical Industry,2019,48(9):2193-2197.
    [7]
    倪吉旭, 刘洪军.废旧手机电路板非金属回收及在塑料中的再利用进展[J]. 工程塑料应用,2021,49(3):150-155.

    NI J X, LIU H J. Progress on recovery and reuse in plastic of nonmetal in waste mobile phone circuit boards[J]. Engineering Plastics Application,2021,49(3):150-155.
    [8]
    谢奕标.废旧电路板热解动力学及产物分析[J]. 环境工程技术学报,2020,10(2):303-309.

    XIE Y B. Research on pyrolysis kinetics and products analysis of waste circuit boards[J]. Journal of Environmental Engineering Technology,2020,10(2):303-309.
    [9]
    王新杰, 郭玉文, 刘景洋, 等.废印刷线路板非金属粉-木塑复合材料性能[J]. 环境科学研究,2010,23(2):227-231.

    WANG X J, GUO Y W, LIU J Y, et al. Study on the properties of waste printed circuit board nonmetallic powder-wood-plastic composites[J]. Research of Environmental Sciences,2010,23(2):227-231.
    [10]
    刘旸, 刘静欣, 江晓健, 等.废弃电路板中非金属组分的回收利用[J]. 有色金属科学与工程,2016,7(2):1-7.

    LIU Y, LIU J X, JIANG X J, et al. Recycling of non-metallic fractions from waste printed circuit boards[J]. Nonferrous Metals Science and Engineering,2016,7(2):1-7.
    [11]
    赵春虎. 废旧印制电路板中非金属的热解处理及金的回收技术研究[D]. 广州: 华南理工大学, 2017.
    [12]
    李世超. 耐低温环境复合材料树脂基体的设计、制备及性能表征[D]. 大连: 大连理工大学, 2018.
    [13]
    朱永琪, 李红轩, 吉利, 等. 超低温摩擦学研究进展[J/OL]. 摩擦学学报. [2023-01-13]. doi: 10.16078/j.tribology.2022173.
    [14]
    郑夏莲, 马元好, 郑明春.废弃PCB非金属材料的回收处理及高值化利用[J]. 工程塑料应用,2019,47(12):134-138.

    ZHENG X L, MA Y H, ZHENG M C. Recovery processing and higher value application of waste PCB non-metallic materials[J]. Engineering Plastics Application,2019,47(12):134-138.
    [15]
    李锴, 王德志, 吴壮志, 等.高能球磨活化钼粉的低温致密化[J]. 中国有色金属学报,2021,31(9):2447-2454.

    LI K, WANG D Z, WU Z Z, et al. Low-temperature densification of molybdenum powder activated by high-energy ball milling[J]. The Chinese Journal of Nonferrous Metals,2021,31(9):2447-2454.
    [16]
    李斌. 废旧电路板中金属和非金属材料的界面分选工艺研究[D]. 兰州: 兰州理工大学, 2020.
    [17]
    CHENG X, CHEN Y X, DU Z L, et al. Effect of the structure of curing agents modified by epoxidized oleic esters on the toughness of cured epoxy resins[J]. Journal of Applied Polymer Science,2011,119(6):3504-3510. doi: 10.1002/app.32998
    [18]
    WANG F Z, DRZAL L T, QIN Y, et al. Enhancement of fracture toughness, mechanical and thermal properties of rubber/epoxy composites by incorporation of graphene nanoplatelets[J]. Composites Part A:Applied Science and Manufacturing,2016,87:10-22. doi: 10.1016/j.compositesa.2016.04.009
    [19]
    RATNA D, SIMON G P. Thermal and mechanical properties of a hydroxyl-functional dendritic hyperbranched polymer and trifunctional epoxy resin blends[J]. Polymer Engineering & Science,2001,41(10):1815-1822.
    [20]
    梁毅, 龙雪, 金海, 等.低温阀门密封副材料性能研究[J]. 机械工程师,2018(7):128-130. doi: 10.3969/j.issn.1002-2333.2018.07.047

    LIANG Y, LONG X, JIN H, et al. Research on the performance of cryogenic valve sealing sub-materials[J]. Mechanical Engineer,2018(7):128-130. doi: 10.3969/j.issn.1002-2333.2018.07.047
    [21]
    王文博, 张广鑫, 王旭, 等.环氧树脂增韧方法研究进展[J]. 化学与粘合,2020,42(5):388-391. doi: 10.3969/j.issn.1001-0017.2020.05.019

    WANG W B, ZHANG G X, WANG X, et al. Research progress in toughening methods for the epoxy resin[J]. Chemistry and Adhesion,2020,42(5):388-391. doi: 10.3969/j.issn.1001-0017.2020.05.019
    [22]
    吴诚, 潘皖江, 沈默, 等.低温环氧树脂增韧改性与性能研究[J]. 绝缘材料,2018,51(12):11-15.

    WU C, PAN W J, SHEN M, et al. Study on toughening modification and performance of epoxy resin used at low temperature[J]. Insulating Materials,2018,51(12):11-15.
    [23]
    许乔奇. T700碳纤维/环氧复合材料超低温力学性能研究[D]. 大连: 大连理工大学, 2016.
    [24]
    HE Y X, CHEN Q Y, YANG S, et al. Micro-crack behavior of carbon fiber reinforced Fe3O4/graphene oxide modified epoxy composites for cryogenic application[J]. Composites Part A:Applied Science and Manufacturing,2018,108:12-22. doi: 10.1016/j.compositesa.2018.02.014
    [25]
    SUN T, WU Z J, ZHUO Q, et al. Microstructure and mechanical properties of aminated polystyrene spheres/epoxy polymer blends[J]. Composites Part A: Applied Science and Manufacturing,2014,66:58-64. doi: 10.1016/j.compositesa.2014.06.015
    [26]
    刘新, 武湛君, 蔡永超, 等.超低温处理对T700碳纤维/环氧复合材料拉-压疲劳性能的影响[J]. 宇航学报,2014,35(7):850-856.

    LIU X, WU Z J, CAI Y C, et al. Effect of cryogenic treatment on tension-compression fatigue properties of T700/epoxy composite[J]. Journal of Astronautics,2014,35(7):850-856.
    [27]
    管传金, 王景伟, 伊勇, 等.废弃印刷线路板及热固性环氧树脂废弃物非金属材料的回收研究[J]. 江苏理工学院学报,2017,23(6):1-7.

    GUAN C J, WANG J W, YI Y, et al. Study on recovering epoxy resins and glass fiber from waste PCB and thermosetting epoxy resin[J]. Journal of Jiangsu Teachers University of Technology,2017,23(6):1-7.
    [28]
    CHEN Z K, YANG G, YANG J P, et al. Simultaneously increasing cryogenic strength, ductility and impact resistance of epoxy resins modified by n-butyl glycidyl ether[J]. Polymer,2009,50(5):1316-1323. doi: 10.1016/j.polymer.2008.12.048
    [29]
    郑通, 翟双东, 庄艳歆, 等.从硅渣中回收提纯金属硅的研究[J]. 铁合金,2021,52(3):23-27.

    ZHENG T, ZHAI S D, ZHUANG Y X, et al. Study on recovery and purification of metallic silicon from silicon slag[J]. Ferro-Alloys,2021,52(3):23-27.
    [30]
    谢明辉, 阮久莉, 白璐, 等.太阳能级多晶硅生命周期环境影响评价[J]. 环境科学研究,2015,28(2):291-296. doi: 10.13198/j.issn.1001-6929.2015.02.17

    XIE M H, RUAN J L, BAI L, et al. Environmental impacts of solar grade polysilicon based on life cycle assessment[J]. Research of Environmental Sciences,2015,28(2):291-296. doi: 10.13198/j.issn.1001-6929.2015.02.17
    [31]
    郭菁, 邢鹏飞, 涂赣峰, 等.单晶及多晶硅切割废料中的高纯硅回收[J]. 材料科学与工艺,2011,19(4):103-106. doi: 10.11951/j.issn.1005-0299.20110421

    GUO J, XING P F, TU G F, et al. Recovering high-purity silicon from mono-/poly-silicon cutting loss slurry[J]. Materials Science and Technology,2011,19(4):103-106. ⊗ doi: 10.11951/j.issn.1005-0299.20110421
  • 加载中

Catalog

    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Figures(6)  / Tables(2)

    Article Metrics

    Article Views(199) PDF Downloads(30) Cited by()
    Proportional views
    Related

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return