Abstract: In order to solve the problems of difficult recovery of non-metallic components and high secondary pollution rate in waste printed circuit board (PCB), 298/77 K cycling treatment technology was introduced. First, the effect of temperature change on the internal structure of PCB and the change of mechanical properties in PCB were analyzed, and the actual effect of static and centrifugal separation on the recovery rate of non-metallic components in PCB was tested. Then, CaF₂ was introduced as strong oxidant in the refining process. The recovery of silicon components after the change of internal structure of PCB was tested and the actual purity of silicon elements after recovery was determined. The results showed that after 298/77 K cycle treatment, the internal structure of PCB changed significantly under the influence of temperature cycle. The mechanical properties were significantly reduced. The actual output of PCB non-metallic components and the recovery of silicon components had been significantly improved compared with the traditional treatment, and the impurities in the original PCB had been well removed. The mass fraction of silicon element accounted for more than 97%.